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November 2001

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Subject:
From:
Mark Mazzoli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Nov 2001 10:54:40 -0800
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Hi Russ,

I used to run about 1.3-1.5N and about 165g/l Cu with an ORP of 550-580 or
so.    It would seem to me that the parameters you listed would lead to a
very fast but somewhat less precise etchant.  You may experience undercut
and/or poor conductor edge quality.  And you're right about potential
equipment problems, particularly titanium shafts, nuts, bolts, etc.  But it
would be fast......... If you're working with 1/4 ounce copper you may want
to stand back a few feet to catch the layers as they fly off.....

Check with Mr. Sedlak..... he is The Man for cupric questions.

Mark


At 10:14 AM 11/28/01 -0800, you wrote:
>----Thanks to everyone for the info , I was a weak on Cupric, (I spent
>my life using mostly Ammonium and Ferric, amongst other more exotic
>etches)
>
>Any way one more simple or not so simple question :
>
>         Would you run a Cupric etcher @ 140g/l Cu and 5N HCl .?
>
>         Is It a correct assumption that somewhat lower N, and higher
>copper would , provide faster etch rate. It just seems to me that
>operating at an extreme N will basically just cost money in the form of
>excess HCL usage , not to mention the wear and tear on the equipment,
>and operators.,
>
>
>Again thanks for the information!
>
>Russell Smith
>
>

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