Heinz

A couple of ideas;

There may be a slight resist residue from the photoresist developing step
inhibiting adhesion.
A longer, warmer rinse may alleviate this problem followed by a quick
neutralizing dip in
10% HCL.  Also a preclean/acid pickle and initial plating in a gold strike
tank with a below 7 ph will also help adhesion.
A quick experiment involving a stand alone coupon, that witnesses identical
processing as the board in one case and in the other case forgoes the
secondary photo-lamination with all other
variables the same (including time between initial electroless nickel/gold
and final gold plate, bakes, rinses,G10 material etc.) should help pin point
the problem....

Regards,

Ron VandenDolder
Product Development Manager
Telaxis Communications
SouthDeerfield, Ma 01375
413-665-8551
[log in to unmask]

-----Original Message-----
From: Heinz Mader [mailto:[log in to unmask]]
Sent: Wednesday, November 28, 2001 10:33 AM
To: [log in to unmask]
Subject: [TN] Adhesion problems of galvanic gold on electroless nickel
gold


Hallo outthere in the big pcb world
A qestion from switzerland
We produce a board(material G 10) After full plating electroless nickel
gold the adhesion is good.Then we laminate fotoresist film for goldmask and
develope with soda.
We let  plate the bond gold externel. This Gold has not enough adhesion
with tape test We see that not later not after Galvanic plating

Has anyone some experince solving that problem


With kind regards

Heinz Mader
Ascom AG
3000 Berne
Switzerland

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