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Subject:	Adhesion problems of galvanic gold on electroless nickel gold
From:	Heinz Mader <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 28 Nov 2001 09:32:36 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (28 lines)

Hallo outthere in the big pcb world
A qestion from switzerland
We produce a board(material G 10) After full plating electroless nickel
gold the adhesion is good.Then we laminate fotoresist film for goldmask and
develope with soda.
We let  plate the bond gold externel. This Gold has not enough adhesion
with tape test We see that not later not after Galvanic plating

Has anyone some experince solving that problem


With kind regards

Heinz Mader
Ascom AG
3000 Berne
Switzerland

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