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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 27 Nov 2001 15:17:09 -0700 |
Content-Type: | text/plain |
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> Fellow Technetters:
>
> I am sending this looking for any help, I guess I've done everything
> as far as the process and I haven't been able to resolve the issue. We've
> been having soldering problems for a while with QFPs with 85 Sn/15 Pb
> finish on the leads. The solder doesn't flow properly and an acceptable
> solder joint is not formed, the leads can be sometimes lifted with no
> effort. The solder paste was checked after the screen printer operation
> and it looked alright, the oven profile was also verified and it's always
> within the solder paste manufacturer's recommendations. This problem seems
> to be affecting all the different products with this type of component.
> These part numbers are manufactured by Altera. Has anybody experienced
> similar problems with QFPs from this manufacturer?, Does anybody have
> recommendations as far as the reflow oven profile?. I read somewhere that
> this particular alloy has the liquidus temperature at 205 degrees, is this
> accurate?
>
Any help would be really appreciated
> Jorge Rodriguez
> Process Engineer
> Varian Electronics Manufacturing
> E-mail: [log in to unmask]
>
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