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November 2001

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Subject:
From:
peter lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Nov 2001 13:57:41 -0800
Content-Type:
text/plain
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text/plain (105 lines)
Other than utilizing exit cooling fans, what other
cooling medium and method would be considered
practical?

Rgds,
Peter

--- Graham Collins <[log in to unmask]>
wrote:
> Peter
> I agree - cooling the jigs can be a big problem for
> throughput.  One solution I've seen was to have a
> rack at the unload end, the operators would put the
> jigs in it and a fan directed at the rack would
> convection cool them faster than just sitting.
>
> regards
>
> Graham Collins
> Process Engineer,
> Northrop Grumman
> Atlantic Facility of Litton Systems Canada
> (902) 873-2000 ext 6215
>
> >>> [log in to unmask] 11/27/01 03:44AM >>>
> Hello,
>
> Has anyone experienced problems with running boards
> through wave
> soldering in a pallet with deep machined pockets?
>
> My jigs are quite thick (~0.5") in order to mask off
> the high filter
> components on the solder side. As a result the jigs
> get very hot after
> soldering and takes long time to cool down to be
> feed back to the cycle.
> It also affects my profiling, throughput, and seems
> to create more dross
> than usual.
>
> Any comment or advice?
>
> Rgds,
> Peter
>
>
>
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