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November 2001

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Subject:
From:
Graham Collins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Nov 2001 09:40:51 -0500
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Hi Jason
I'm not qualified to comment on joint reliability on "near neighbors", but can point out that you need to follow rules for moisture sensitive parts if any are nearby.  If the heat effect is reflowing the leads then you are risking moisture related damage (e.g. popcorning) if the board hasn't been baked and/or dry stored.

regards

Graham Collins
Process Engineer, 
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215

>>> [log in to unmask] 11/05/01 10:24AM >>>
Hello,
I am hoping someone here can help with the following:  recent inquiries
have come up with respect to the effect of BGA rework to surrounding
components.  Can the heat effect to surrounding components -- the
possibility (and probability) that they will reach reflow temperatures,
cause problems?  I am thinking of cases where some BGA balls might reach
reflow temperatures and others might not on a single package at
proximity to the reworked site.  Another case would be where BGA
packages at proximity to the reworked BGA are simply reaching high
temperatures - for possibly many heat/rework cycles..

Impact to solder joint metallurgy
Impact to solder joint reliability

Any help or reference would be greatly appreciated.

--
Jason Cross
Physical Technology Engineer
Alcatel Canada, Inc.
(613) 784-4793

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