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November 2001

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Subject:
From:
JASON CROSS <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Nov 2001 09:24:24 -0500
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Hello,
I am hoping someone here can help with the following:  recent inquiries
have come up with respect to the effect of BGA rework to surrounding
components.  Can the heat effect to surrounding components -- the
possibility (and probability) that they will reach reflow temperatures,
cause problems?  I am thinking of cases where some BGA balls might reach
reflow temperatures and others might not on a single package at
proximity to the reworked site.  Another case would be where BGA
packages at proximity to the reworked BGA are simply reaching high
temperatures - for possibly many heat/rework cycles..

Impact to solder joint metallurgy
Impact to solder joint reliability

Any help or reference would be greatly appreciated.

--
Jason Cross
Physical Technology Engineer
Alcatel Canada, Inc.
(613) 784-4793

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