Recently we have been experimenting with a Chomerics product - Thermaform -
it is a two part elastomer thermal compound.  The T644 is a low modulus
compound that is to be injected under a device through a hole in the PCB.
It cures into a soft bead.  It isn't an epoxy so you can still rework the
device reasonably easily.  We experimented with applying it onto the PCB and
installing a device over it, but during the reflow cycle as it cured, it
expanded just enough to push the device partly out of the paste.  There are
a couple other formulations T642 and T646 that have slightly different
properties, and I think they are more for putting over top of a device.

http://www.chomerics.com/products/thermaform.htm

-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: November 3, 2001 6:54 PM
To: [log in to unmask]
Subject: [TN] Ruggedizing Assemblies...


I know what I'm about to ask, probably won't get many responses...I
understand. It has to do with ruggedizing assemblies, mostly having to do
with thermal management.

I've done some pretty extensive searching, and have read quite a bit about
conduction cooling...but I've heard about a type of "Foam" or coating, that
has recently been used to beat the heat...I can't find anything about it
though.

So per chance, I thought I would ask here...anybody know anything about
this?

As always, thanks a bunch!!

-Steve Gregory-

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