Hi all!

I'm a ignorant process guy, I just build stuff. Don't have the "wizard"
knowledge about RF stuff. I gotta question though...

Why do RF components HAVE to have vias beneath the footprint of the devices?

This creates a problem with certain conductive adhesives that are used to
bond the PCA's to the chassis, from what I'm seeing, trying to adhere to
solder that has flowed out from initial reflow, or during rework when trying
to change a suspected failed component after the bloody thing has been bonded
to the chassis.

Solder flows out and wets to the gold planes and de-bonds the adhesive that's
been used to provide ground to the chassis.

Why the 'friggen vias? Can't they be placed just outside the component
footprint where the solder if it goes to the bottomside won't interfere with
whatever black-magic the the RF stuff needs?

Conductive adhesives don't seem to like solder that is liquidous, which will
naturally flow and spread during rework of a suspected failed part...if you
lose ground, you lose god...I've at least learned that, don't quite still
understand it, but ground is god in RF talk...

Those of you that haven't had to deal with this, consider yourselves lucky...

-Steve Gregory-

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