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November 2001

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 3 Nov 2001 19:53:37 EST
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I know what I'm about to ask, probably won't get many responses...I
understand. It has to do with ruggedizing assemblies, mostly having to do
with thermal management.

I've done some pretty extensive searching, and have read quite a bit about
conduction cooling...but I've heard about a type of "Foam" or coating, that
has recently been used to beat the heat...I can't find anything about it
though.

So per chance, I thought I would ask here...anybody know anything about this?

As always, thanks a bunch!!

-Steve Gregory-

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