As a layout designer, I am surprised that they used such small land areas.
Motorola recommends a land of .40 to .50mm. IMO .28mm is insufficient.
See attached PDF from Motorola.

Denis Lefebvre, C.I.D.
Senior PCB Designer
Finisar Corporation
(408)542-3832
http://www.finisar.com

At 10:16 AM 11/19/2001 -0500, you wrote:
>I'm not that far up in the food chain to know all of the particulars, but
>it wouldn't surprise me if that were the case.
>
>What I'm looking for is comments on the increase of pad size and
>corroboration in my belief that it's the wrong solution to this problem.
>
>Tom
>
>At 04:20 AM 11/19/01 -0600, you wrote:
>>Date:    Mon, 19 Nov 2001 08:20:31 -0000
>>From:    Eric Dawson <[log in to unmask]>
>>Subject: Re: BGA bone of contention
>>
>>Hi Tom,
>>Are you wave soldering the other side of the board with the reflow soldered
>>bga.s on top? I have come across this practice and it definitely disturbs
>>the bga joints causing opens which cannot be detected by ordinary X ray
>>inspection.
>>Hope this helps.
>>Regards
>>Eric Dawson
>>
>> > -----Original Message-----
>> > From: Tom Colby [SMTP:[log in to unmask]]
>> > Sent: Friday, November 16, 2001 8:47 PM
>> > To:   [log in to unmask]
>> > Subject:      [TN] BGA bone of contention
>> >
>> > Help me out with this technetters,
>> >
>> > The problem: BGA opens on a HASL board.
>> >
>> > The device: Motorola MCF5272, a 196 MAPBGA, 1mm pitch, ball size of
>> > 0.35/0.65. Substrate land size unknown. Footprint designed with a pad  of
>> > 0.28mm.
>> >
>> > Management's solution is to increase the pad size to 0.4mm. I say to look
>> > elsewhere in the process for the problem.
>> >
>> > I'd like to hear the opinions of my esteemed colleagues. What do you say
>> > folks?
>> >
>> > Thanks in advance,
>> >
>> > Tom
>> >
>> > --------------------------------------------------------------------------
>
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