I'm not that far up in the food chain to know all of the particulars, but
it wouldn't surprise me if that were the case.

What I'm looking for is comments on the increase of pad size and
corroboration in my belief that it's the wrong solution to this problem.

Tom

At 04:20 AM 11/19/01 -0600, you wrote:
>Date:    Mon, 19 Nov 2001 08:20:31 -0000
>From:    Eric Dawson <[log in to unmask]>
>Subject: Re: BGA bone of contention
>
>Hi Tom,
>Are you wave soldering the other side of the board with the reflow soldered
>bga.s on top? I have come across this practice and it definitely disturbs
>the bga joints causing opens which cannot be detected by ordinary X ray
>inspection.
>Hope this helps.
>Regards
>Eric Dawson
>
> > -----Original Message-----
> > From: Tom Colby [SMTP:[log in to unmask]]
> > Sent: Friday, November 16, 2001 8:47 PM
> > To:   [log in to unmask]
> > Subject:      [TN] BGA bone of contention
> >
> > Help me out with this technetters,
> >
> > The problem: BGA opens on a HASL board.
> >
> > The device: Motorola MCF5272, a 196 MAPBGA, 1mm pitch, ball size of
> > 0.35/0.65. Substrate land size unknown. Footprint designed with a pad  of
> > 0.28mm.
> >
> > Management's solution is to increase the pad size to 0.4mm. I say to look
> > elsewhere in the process for the problem.
> >
> > I'd like to hear the opinions of my esteemed colleagues. What do you say
> > folks?
> >
> > Thanks in advance,
> >
> > Tom
> >
> > --------------------------------------------------------------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------