Hi Tom,
Are you wave soldering the other side of the board with the reflow soldered
bga.s on top? I have come across this practice and it definitely disturbs
the bga joints causing opens which cannot be detected by ordinary X ray
inspection.
Hope this helps.
Regards
Eric Dawson

> -----Original Message-----
> From: Tom Colby [SMTP:[log in to unmask]]
> Sent: Friday, November 16, 2001 8:47 PM
> To:   [log in to unmask]
> Subject:      [TN] BGA bone of contention
>
> Help me out with this technetters,
>
> The problem: BGA opens on a HASL board.
>
> The device: Motorola MCF5272, a 196 MAPBGA, 1mm pitch, ball size of
> 0.35/0.65. Substrate land size unknown. Footprint designed with a pad  of
> 0.28mm.
>
> Management's solution is to increase the pad size to 0.4mm. I say to look
> elsewhere in the process for the problem.
>
> I'd like to hear the opinions of my esteemed colleagues. What do you say
> folks?
>
> Thanks in advance,
>
> Tom
>
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