TECHNET Archives

November 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 Nov 2001 11:06:55 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (111 lines)
Hi, Rudy,

Assumption is correct - over-etch occurs in the same place on all boards of
the same design, and is on the patterns. Masked traces are in good
condition. Fab house has not suggested a change of design as a solution to
the problem - in fact they didn't even want the over-etched boards back, so
my belief is that they knew about the problem even before they shipped the
product.

I myself need to learn a lot more about what is a produceable design and
what isn't as far as this sort of thing is concerned, though I would trust
that our board designers should know more about that than I. They
supposedly followed IPC-2221 & 2222 when putting the design together, but
who knows what was missed (if anything).

Does anyone else have this problem with boards with blind vias? Or if it's
DFM'd, what steps were taken to avoid this issue?

Best regards

Peter Duncan




                    "<Rudy
                    Sedlak>"             To:     [log in to unmask]
                    Sent by:             cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    TechNet              Aero/ST Group)
                    <[log in to unmask]        Subject:     Re: [TN] Over-etch II
                    ORG>


                    11/16/01
                    11:23 PM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum."






This MAY be so simple, we will wonder why/how they did not see the
problem...

To understand this analysis/suggestion, you have to understand the
difference
between pattern plating (which is done after photoresist application) and
panel plating (which is done before photoresist application).

Again, I am grasping/guessing here, as I really do not understand the
process
well enough to give "expert" advice....

If they are doing a "selective" panel plate, which would make the Copper
selectively thicker, this would be an obvious answer...

I assume that the over etch problem occurs at the same place on all the
boards of the same design?  And it occurs on 100% of the boards of a
similar
design?  (In other words, is the problem one of process/board design, or
one
related to equipment used in fabrication?)

If the problem is not always in the same place, this would speak to
equipment
issues at their facility...and even if the the problem occurs at the same
place on all boards, it could still POSSIBLY be equipment issues at the
fabrication facility.

Rudy Sedlak
RD Chemical Company

---------------------------------------------------------------------------------

Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
---------------------------------------------------------------------------------





[This e-mail is confidential and may also be privileged. If you are not the
intended recipient, please delete it and notify us immediately; you should
not copy or use it for any purpose, nor disclose its contents to any other
person. Thank you.]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2