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November 2001

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Nov 2001 16:54:29 -0600
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Check the archive for this.  I remember reading about prefilling the vias, solder plugging in essence.  I know of a few people who have accomplished this through the volume of paste.  They compensated for the loss down the via with paste.  
Kathy 



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