Help me out with this technetters,

The problem: BGA opens on a HASL board.

The device: Motorola MCF5272, a 196 MAPBGA, 1mm pitch, ball size of
0.35/0.65. Substrate land size unknown. Footprint designed with a pad  of
0.28mm.

Management's solution is to increase the pad size to 0.4mm. I say to look
elsewhere in the process for the problem.

I'd like to hear the opinions of my esteemed colleagues. What do you say folks?

Thanks in advance,

Tom

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