Hi there.  I sent this out once before, but it might have bounced.
Is there any guideline or procedure detailing how to handle single surface
mount parts, especially fine pitch.  I've found several on moisture and ESD,
but none on re-packaging.  Our production numbers are rather low, so it is
not always best to issue the whole tray of parts to the board shop.  We need
a document to teach the stockroom personnel how to pick up and package
individual parts without bending the leads.
Thanks for your help.


Earl Wildes
Sr. Component Engineer
Korry Electronics Co.
901 Dexter Ave N.
Seattle, WA  98109
206-694-1398
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