This MAY be so simple, we will wonder why/how they did not see the problem...

To understand this analysis/suggestion, you have to understand the difference
between pattern plating (which is done after photoresist application) and
panel plating (which is done before photoresist application).

Again, I am grasping/guessing here, as I really do not understand the process
well enough to give "expert" advice....

If they are doing a "selective" panel plate, which would make the Copper
selectively thicker, this would be an obvious answer...

I assume that the over etch problem occurs at the same place on all the
boards of the same design?  And it occurs on 100% of the boards of a similar
design?  (In other words, is the problem one of process/board design, or one
related to equipment used in fabrication?)

If the problem is not always in the same place, this would speak to equipment
issues at their facility...and even if the the problem occurs at the same
place on all boards, it could still POSSIBLY be equipment issues at the
fabrication facility.

Rudy Sedlak
RD Chemical Company

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