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November 2001

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Nov 2001 17:00:01 +0100
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Peter,

an easy, fast check for outgassing would be using some oil that can
withstand the temperature and has of course no water-content, apply it to a
through hole and heat the barrel with a solder iron. Best done under a
microscope for better visibility. You should not see any bubbles from
outgassing.
Haven´t done it myself but still remember that advice given here or on
SMTnet a while ago and connect it somehow with  Earl, The Moonman, but don´t
nail me for that one.

I´m not sure if baking those boards will bring any relief.

Good luck

Wolfgang

-----Ursprüngliche Nachricht-----
Von: PL [mailto:[log in to unmask]]
Gesendet am: Donnerstag, 1. November 2001 07:50
An: [log in to unmask]
Betreff: [TN] Blow holes in solder joints

Hello,

I would like to ask your input on trouble shooting a wave soldering
process that I've encountered producing blow holes on the PCA. The blow
holes were seen at random locations, mostly on small and light caps. The
boards were manufactured in recent weeks. Some board warppage was
noticed after the wave.

Things I tried:
- Boards from a different manufactured date, no effect
- Turned on turbulence wave. It reduced but didn't completely eliminate
the defect
- used stiffener on board edge to reduce board sagging
- used dummy weights on top of parts seen having defect to minimize
"dancing" during wave

How critical is the component lead-to-hole ratio as far as its impact on
solder joint quality?
Could anyone explain how a blow hole can occur and possible steps taken
to eliminate the defect?

Rgds,
Peter



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