We are a contract manufacturer. One of our OEM customers has completed a
design which uses ~50-75 0.016" vias in ~0.038" square lands for 0603
components, on a 0.031" board. We have already made redesign
recommendations, but there may be a substantial (as many as several
thousand) quantity of boards that need to be assembled with this design.
Does anyone have experience with a soldering process that will yield
reliably high quality solder connections without substantial inspection and
rework given such a design?
Thanks for any comments.
David North
Qualitel Corporation
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------