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November 2001

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Subject:
From:
David North <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Nov 2001 13:26:41 -0800
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We are a contract manufacturer.  One of our OEM customers has completed a
design which uses ~50-75 0.016" vias in ~0.038" square lands for 0603
components, on a 0.031" board.  We have already made redesign
recommendations, but there may be a substantial (as many as several
thousand) quantity of boards that need to be assembled with this design.
Does anyone have experience with a soldering process that will yield
reliably high quality solder connections without substantial inspection and
rework given such a design?

Thanks for any comments.

David North
Qualitel Corporation

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