Dear Grant,

I believe you are on the right path by wanting to avoid systematically
baking incoming components. You should bring up the concern that excessive
bake will impact component solderability and intermetallic growth.

If you are interested to get additional information on this subject you can
check the knowledge base on our web site at www.cogiscan.com, click on
Moisture Sensitive Devices. It contains many technical papers that you might
find useful.


Francois Monette
Cogiscan Inc.
50 De Gaspe, Suite A5
Bromont, Quebec, Canada, J2L 2N8
Tel : (450)534-2644
Fax: (450)534-0092
www.cogiscan.com


Date:    Thu, 15 Nov 2001 11:15:47 +0200
From:    Grant Emandien <[log in to unmask]>
Subject:

Hi All,

I am seeking advice on handling methods of moisture sensitive devices from
reception/storage to use. Components have varying baking requirements after
the packaging has been opened - is baking performed as per. manufacturer's
instructions?

One of our customers is insistent on us, as an assembler to bake
(customer-supplied) components just prior to assembly - this approach
however does impose some impracticalities on production. Our initial counter
proposal is to receive only components in original OEM wrapping indicating
the moisture instructions and class/level and to then return bake and reseal
(vacuum/nitrogen) excess opened material to stores - the package would also
include a humidity indicator. Our proposal is more amenable to production,
but is it sufficient to ensure device integrity? Any insights on the
approach of assemblers?

TIA
Grant

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