This is exactly the type thing making DMF/CE disregarded and impossible.
What everyone is (seems to be) doing is violating all design principles and
whatever rules/standards are known to the PCB/MLB world just to get product
to market without thought of how many times you all must do it over again
and again and again. This includes MLB structures and plating processes.
When are you all going to attempt seeing from the concept to the finished
product?

Many continually ask questions about how can "I" fix something that could
have been prevented in the first place - at the design level using DFM/CE.
How can you ask questions about making boards flatter after lamination? It
cannot be done if the design, material selections, and fab processes are out
of control. How can one even ask about etch? It's something that's been
going on far too long and it's time you all stopped and started doing it
right the first time.

Unbelievable,

MoonMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------