Hi, All,

We have received a number of 12 layer ENIG-finished MLB's with blind via
hole groups, and which are destined to have BGA's (1.27mm pitch) populated
onto them. The boards measure 8.2" x 5.7" and they are warped to the extent
of one corner being raised by between 1.5mm and about 3mm. The axis of the
warp is the long side of a triangle whose other two sides measure about 5.7
x 5.7.

In this age of sensitive boards, does a technology or technique exist for
straightening the boards back into spec - they are class 3 boards - or is
this an area where angels still fear to tread?

The boards are desperately urgent, which is why I'm asking this rather than
simply rejecting them and having them re-made (which takes about a month).

TIA for any help.

Peter Duncan

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