The National Semiconductor web site has a nice application note about
handling of moisture sensitive devices. I believe Motorola has one also.
Would you happen to have any information about proper physical handling
surface mount parts? I need a guideline to give the stockroom for when
small quantities are issued to the line.
Earl Wildes
Sr. Component Engineer
Korry Electronics Co.
901 Dexter Ave N.
Seattle, WA 98109
206-694-1398
[log in to unmask]
-----Original Message-----
From: Grant Emandien [mailto:[log in to unmask]]
Sent: Thursday, November 15, 2001 1:16 AM
To: [log in to unmask]
Subject: [TN] Handling of moisture sensitive devices
Hi All,
I am seeking advice on handling methods of moisture sensitive devices from
reception/storage to use. Components have varying baking requirements after
the packaging has been opened - is baking performed as per. manufacturer's
instructions?
One of our customers is insistent on us, as an assembler to bake
(customer-supplied) components just prior to assembly - this approach
however does impose some impracticalities on production. Our initial counter
proposal is to receive only components in original OEM wrapping indicating
the moisture instructions and class/level and to then return bake and reseal
(vacuum/nitrogen) excess opened material to stores - the package would also
include a humidity indicator. Our proposal is more amenable to production,
but is it sufficient to ensure device integrity? Any insights on the
approach of assemblers?
TIA
Grant
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