Hi Grant,

that´s the trouble with customer supplied components. If you don´t know the
history of that package and the devices in respect to moisture and open time
baking should be the way to go.
Your approach to get those parts in the normal workflow for MSD-parts using
drybacks and recording the history sounds reasonable and you should convince
your customer of the merits of these procedures. In future you may not have
to bake his components.

Good luck 
Wolfgang

-----Ursprüngliche Nachricht-----
Von: Grant Emandien [mailto:[log in to unmask]]
Gesendet am: Donnerstag, 15. November 2001 10:16
An: [log in to unmask]
Betreff: [TN] Handling of moisture sensitive devices

Hi All,

I am seeking advice on handling methods of moisture sensitive devices from
reception/storage to use. Components have varying baking requirements after
the packaging has been opened - is baking performed as per. manufacturer's
instructions?

One of our customers is insistent on us, as an assembler to bake
(customer-supplied) components just prior to assembly - this approach
however does impose some impracticalities on production. Our initial counter
proposal is to receive only components in original OEM wrapping indicating
the moisture instructions and class/level and to then return bake and reseal
(vacuum/nitrogen) excess opened material to stores - the package would also
include a humidity indicator. Our proposal is more amenable to production,
but is it sufficient to ensure device integrity? Any insights on the
approach of assemblers?

TIA
Grant


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