Hi All,

I am seeking advice on handling methods of moisture sensitive devices from
reception/storage to use. Components have varying baking requirements after
the packaging has been opened - is baking performed as per. manufacturer's
instructions?

One of our customers is insistent on us, as an assembler to bake
(customer-supplied) components just prior to assembly - this approach
however does impose some impracticalities on production. Our initial counter
proposal is to receive only components in original OEM wrapping indicating
the moisture instructions and class/level and to then return bake and reseal
(vacuum/nitrogen) excess opened material to stores - the package would also
include a humidity indicator. Our proposal is more amenable to production,
but is it sufficient to ensure device integrity? Any insights on the
approach of assemblers?

TIA
Grant


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