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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 14 Nov 2001 08:08:24 -0600 |
Content-Type: | text/plain |
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Patricia,
I appreciate you input as well. I'm looking for a trail from the work all
you folks, like Werner, you, and probably hundreds of others did on this.
I'm hoping it leads to, how to put this without offending, how the "new"
standards and specifications say these things are reliable primarily based
on plating process management effectiveness and materials.
Thanks again,
Earl
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