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Subject:	Re: Aspect Ratio
From:	"Goldman, Patricia J." <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 14 Nov 2001 08:52:46 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Note that this is a pretty old report.  It was published in 1988, but the data for it was generated several years earlier.  I do recall making parts and submitting for this round robin, I believe in the 1984 time frame.

Patty
Patricia J. Goldman
PPG Industries, Inc.
724-274-3417
[log in to unmask]


-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, November 14, 2001 7:48 AM
To: [log in to unmask]
Subject: Re: [TN] Aspect Ratio


Hi Earl,
Round robin testing was done--the details and results can be found in
IPC-TR-579 "Round Robin Reliability Evaluation of Small Diameter Plated
Through Holes in Printed Wiring Boards."

Werner Engelmaier

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