/Dear all,

I'm looking for some advice on the threshold limits for solder temperatures,
if for example, HMP solder is solidus/liquidus at say 296-301 deg C, what is
the highest temperature excursion it can see in service before the
properties of the soldered connection are affected?

I heard somewhere that as a rule of thumb you should allow around 40 deg C
below the melting point of the solder being used.

Any help/advice that you can give would be appreciated.

regards,

Pat Diamond
Weston Aerospace
Farnborough
UK

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