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November 2001

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Nov 2001 21:58:18 -0600
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You've asked the big question of my day. Board shops differ both on rhetoric
and fact. It's been little different since I've been in the business dating
back somewhat. Always, there is a demand for more and less - as I need to
package more on real estate that must be smaller.

Surprisingly, most board shops are pretty honest about this question - in
terms of discussion/rhetoric. Maybe honest should be stated as innocent.
Fact, on the other hand, is a bit more hard to verify and/or validate.
Still, we move ever forward.

There's a lot going on here. As usual, we seem to be going down a road at
ever increasing speeds needing not a rush but a solution (chemical or
otherwise). It's a bit driving a modern vehicle down a not so modern roadway.

Everyone on every committee associated with all the great IPC guidelines,
standards, and specifications constantly work hard to find solutions
(chemical or otherwise) to this question. I can't help feeling they are a
bit overwhelmed by the issue. Most of us innocents are so.

This is what one seemingly important discussion is all about. Please provide
your findings along with evidence concerning plating chemistry, processes,
plating thickness throughout the hole, plating ductility, material Tg, and
anything else you find as verification the design meets original intent and
validation clearly showing the customer contract requirements are met.

We all await,

MoonMan

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