Peter,

Hope you REALLY like EXTENSIVE stuff. I think I sent this to you before
anyway.

Earl Moon
----- Original Message -----
From: "Peter Lee" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 12, 2001 4:04 AM
Subject: [TN] New Product Introduction checklist


> Hello,
>
> I like to get your inputs on evaluating a customer design prior to
> building a prototype (electronic assembly). This may include any DFM/DFT
> analysis and also in-house capability analysis.
>
> Specifically, what key features of the assembly do you consider in
> analyzing the product for any manufacturing issue that may arise during
> the build?
>
> For example, just to name a few:
> - Mixed technology -> affect process selection and flow
> - type of devices on board (0402, BGA, washable comp., heat sensitive
> comp)
> - jigs & fixtures requirements
> - board finish, size etc.
>
> Also how would each of the features affect your decision and method to
> build?
>
> I am looking for a more comprehensive checklist or steps that one can go
> through or follow in analyzing the product design prior to quoting and
> prototyping. I would greatly appreciate any inputs on this rather large
> topic. Later on I can provide a summary of all the feedbacks I receive
> as well.
>
>
> Rgds,
> Peter Lee
> Creation Technologies Inc.
>
>
> _________________________________________________________
> Do You Yahoo!?
> Get your free @yahoo.com address at http://mail.yahoo.com
>
> --------------------------------------------------------------------------
-------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------