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November 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Nov 2001 10:37:32 +0800
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No problems that I know of apart from the hassle of rework. As you know,
parylene has to be "sand-blasted" off to remove it, and if it gets
underneath BGA's, it could  make their removal pretty difficult. Do you
plan to epoxy underfill the BGA's at all? It might be worth considering if
you don't have such a plan. A capillary action flow-type underfill applied
after the BGA has been mounted will support the BGA solder joints, but it
has two other advantages in you case - 1) it is reworkable at soldering
temperature and 2) it will act as a barrier to parylene getting underneath
the BGA's and holding them to the board in a death grip.

Peter Duncan



                    "Houston,
                    Terri"               To:     [log in to unmask]
                    <Terri_Housto        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    [log in to unmask]>           Aero/ST Group)
                    Sent by:             Subject:     [TN] Parylene coating PBGAs
                    TechNet
                    <[log in to unmask]
                    ORG>


                    11/10/01
                    12:35 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum."






Hi folks,

We're designing a board assembly, which has 2 PBGAs on it. The plan is to
coat the boards with Parylene since they're going into an industrial
environment.

Is there any information in the industry about recommendations or problems
in parylening board assemblies containing PBGAs?

Thanks in advance,

Terri

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