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November 2001

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 10 Nov 2001 12:15:59 EST
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Hi Nancy,
IPC-7530, Guidelines for Temperature Profiling for Mass Soldering Processes
(Reflow & Wave), was written just to answer your questions.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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