Yes, because the spec (class 3) is 25% of H or 0.5 mm which ever is less.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Cathy Killen
> Sent: Friday, November 09, 2001 4:06 AM
> To: [log in to unmask]
> Subject: [TN] Pads -vs- Paste -vs- Components
>
>
> Hi,
> As technology has forced component manufacturers ever decreasing
> real estate
> on SMT, components such as capacitors have become taller, is it still
> possible to achieve IPC standards minimum fillet height of 1/4 of the
> component termination?
> And...
> What is the optimum pad size, screen aperture size and paste volume
> relationship for a range of chip components in various sizes?
>
> Thanks in advance.
> Cathy Killen
> Training Instructor
> Smtek Europe Ltd.
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> otherwise expressly indicated.
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