Boy this is something I have not heard of in a long long time, HOT OIL
REFOLW. We used to call it hydrosqueegee. Use the hot oil to remove the
excess solder from the solder dip operation, the predecessor to HAL. The
main problem that I can remember is the thinnest of the final coating. The
coating was so thin is was almost pure intermetallic. The solderability of
the product was hours if not minutes afer the process. If you made the
boards, raw boards that is, and assembled them across the hall, perhaps they
would solder. If you had to send them across the street forget it, they were
no longer solderable.

If was an interesting and messy operation, I would think that OSHA would
have a picnic today with that old process today.

This process was used by Sanders Associates and Honeywell back in the 60's.
The next evolution of board was the electroplated tin/lead fused process and
as Paul Harvey would say, now you know the rest of the story.

Leo Lambert

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Genny Gibbard
Sent: Friday, November 09, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Hot Oil


You learn something new (or new to you) every day.
I was just told of a board finishing process called Hot Oil Solder
Levelling.  It was portrayed as a very flat, nice finish.  I was also told
that it is old technology, which may be why I am not familiar with it.  It
is only within the last year that I have really gotten involved with
specifying board finishes.  I've been searching on the internet to learn
more and am a bit confused.
My questions:
Is Hot Oil Reflow and Hot Oil Surface Levelling the same thing?  If not,
what is the difference?
What are advantages/disadvantages to this over HASL, or any of the newer
so-called 'flat' finishes needed for fine pitch?

Thanks.

Genny Gibbard (mailto:[log in to unmask])

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