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November 2001

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Subject:
From:
"Anderson, Greg (IndSys, GEFanuc, NA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Nov 2001 13:20:24 -0500
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Genny,
        A lifetime ago I was involved with a solder leveling system called
the Lightning.  It involved immersion fluxing/preheating the panel, then
immersing it in a pot of molten solder, then using an immersion hot oil with
liquid knife technology to squeegee the excess solder off the pads and out
of the holes.  Theoretically a system easier to control than air since you
were working with a heavy liquid than a compressible gas.  THEORETICALLY!
        It was extremely dirty and dangerous, and you wouldn't want to go
there.

Greg Anderson
Senior Advanced Manufacturing Engineer
GE Fanuc Automation
Charlottesville, VA 22911
Phone:  434-978-5181
FAX:  434-978-5898
e-mail: [log in to unmask]




-----Original Message-----
From: Genny Gibbard [mailto:[log in to unmask]]
Sent: Friday, November 09, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Hot Oil


You learn something new (or new to you) every day.
I was just told of a board finishing process called Hot Oil Solder
Levelling.  It was portrayed as a very flat, nice finish.  I was also told
that it is old technology, which may be why I am not familiar with it.  It
is only within the last year that I have really gotten involved with
specifying board finishes.  I've been searching on the internet to learn
more and am a bit confused.
My questions:
Is Hot Oil Reflow and Hot Oil Surface Levelling the same thing?  If not,
what is the difference?
What are advantages/disadvantages to this over HASL, or any of the newer
so-called 'flat' finishes needed for fine pitch?

Thanks.

Genny Gibbard (mailto:[log in to unmask])

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