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November 2001

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Subject:
From:
Genny Gibbard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Nov 2001 11:27:27 -0600
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You learn something new (or new to you) every day.
I was just told of a board finishing process called Hot Oil Solder
Levelling.  It was portrayed as a very flat, nice finish.  I was also told
that it is old technology, which may be why I am not familiar with it.  It
is only within the last year that I have really gotten involved with
specifying board finishes.  I've been searching on the internet to learn
more and am a bit confused.
My questions:
Is Hot Oil Reflow and Hot Oil Surface Levelling the same thing?  If not,
what is the difference?
What are advantages/disadvantages to this over HASL, or any of the newer
so-called 'flat' finishes needed for fine pitch?

Thanks.

Genny Gibbard (mailto:[log in to unmask])

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