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November 2001

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Subject:
From:
Cathy Killen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Nov 2001 09:06:09 -0000
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Hi,
As technology has forced component manufacturers ever decreasing real estate
on SMT, components such as capacitors have become taller, is it still
possible to achieve IPC standards minimum fillet height of 1/4 of the
component termination?
And...
What is the optimum pad size, screen aperture size and paste volume
relationship for a range of chip components in various sizes?

Thanks in advance.
Cathy Killen
Training Instructor
Smtek Europe Ltd.
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