Hi Technet,

I need some help to identify the most common methods of thermocouple
placement when profiling reflow processes.  And while we are on the
subject, I would also like to collect information on targeting for typical
or recommended profiles versus absolute min/max boundaries.  Just three
easy multiple choice questions....

1. Where do you put the thermocouple?
   a. Embedded in a solder joint?
   b. On top surface of a component? (If so - how do you attach the TC to
   the part?)
   c. On surface of the PWB?
   d. In air?

2. Do you target reflow profiles to fit a "typical" curve or do you just
try to stay below a maximum?
   a. Target for typical?
   b. Stay below maximum?

3. How do you specify that Typical or Maximum condition?
   a. Peak Temperature and Maximum Time at that Peak?  (Please define
   conditions.)
   b. Total time above a fixed value (usually 183°C or 200°C)? (Please
   define conditions.)
   c. Solder Paste Alloy composition for above values?  (If you are running
   both SnPb and Pb-free, please reply for both)

If any of you would like to share soft copies of actual time/temp profiles
that you use for targeting or specifying an acceptable range of reflow,
please email to me off-line.

Thanks in advance for your help.
Nancy Reynolds
KEMET Electronics
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