Hallo outthere in the big pcb world
A qestion from switzerland
We produce a board(material G 10) After full plating electroless nickel
gold the adhesion is good.Then we laminate fotoresist film for goldmask and
develope with soda.
We let plate the bond gold externel. This Gold has not enough adhesion
with tape test We see that not later not after Galvanic plating
Has anyone some experince solving that problem
With kind regards
Heinz Mader
Ascom AG
3000 Berne
Switzerland
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