TECHNET Archives

November 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Subject:
From:
Earl Moon <[log in to unmask]>
Date:
Wed, 14 Nov 2001 08:08:24 -0600
X-To:
Patty Goldman <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>
Parts/Attachments:
text/plain (22 lines)
Patricia,

I appreciate you input as well. I'm looking for a trail from the work all
you folks, like Werner, you, and probably hundreds of others did on this.
I'm hoping it leads to, how to put this without offending, how the "new"
standards and specifications say these things are reliable primarily based
on plating process management effectiveness and materials.

Thanks again,

Earl

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2