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Fri, 9 Nov 2001 12:59:56 -0500 |
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Sounds like the old HydroSqueegee. it leaves a flat finish on an already
solder coated board but it's flat because most of the solder has been blown
off. To my recollection of 20-25 years ago, the residual solder thickness
is about .05 to .1 mil. barely more than the intermetallic. Does not have
a great shelf life.
George Carroll
Process Engineer
Siemens Energy and Automation
Johnson City, TN
[log in to unmask]
-----Original Message-----
From: Genny Gibbard [mailto:[log in to unmask]]
Sent: Friday, November 09, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Hot Oil
You learn something new (or new to you) every day.
I was just told of a board finishing process called Hot Oil Solder
Levelling. It was portrayed as a very flat, nice finish. I was also told
that it is old technology, which may be why I am not familiar with it. It
is only within the last year that I have really gotten involved with
specifying board finishes. I've been searching on the internet to learn
more and am a bit confused.
My questions:
Is Hot Oil Reflow and Hot Oil Surface Levelling the same thing? If not,
what is the difference?
What are advantages/disadvantages to this over HASL, or any of the newer
so-called 'flat' finishes needed for fine pitch?
Thanks.
Genny Gibbard (mailto:[log in to unmask])
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