Hello Guys,
I have been experiencing component skewing after reflow.
However, when i used type 6 paste (no clean flux), there is no skewing
or movement of the component but a lot of voids.
When i used type 3 paste, the voids were reduced but there is much skewing
of the components. Seems voiding and skewing were in contrast.
Does anybody had experienced the same problem. Had they gotten the
optimum parameter? (Less voids, no skewing?).
My process is solder paste dispensing, then attach the component and reflow
in an N2 Blanketed oven.
Paste is leadfree (alloy : 91.5Sn8.5Sb).

Appreciate any help

God Bless


thanks

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