Is it the 10 mil tailoring core CIC type close to the surface? If so, this
is done with relatively "normal" rework profiling, procedures, and processes
depending on the thermal contacts to the device from the core just as if
originally soldered considering carefully the relief required. If it is the
constraining type, like 60 mil core in the MLB center, depending on layers
sandwiched around it, and has many thermal contacts to the BGA, it can be
more difficult depending on the original soldering profile.

Is this a super/perimeter BGA or, most likely, ceramic? If so, the device's
heat sink also will cause problems. On it goes. Suggest running the
experiment on dummy boards with likewise dummy components. We all need to
know more in this area of expanding concern.

MoonMan

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