IPC-D-275, 4.1.8.1, paragraph 1 is repeated word for word in IPC-2221,
8.1.9.1, paragraph 1, as you state [except, of course, the numbering of the
referenced paragraphs and figures].  The paragraph following your paragraph
is substantially different.

Dave Fish
----- Original Message -----
From: "Ken Patel" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 30, 2001 9:56 AM
Subject: [TN] Component Mounting Techniques for Shock and Vibration


> All,
> I know that IPC-D-275 is superseded by IPC-2221 and 2222. As I don't
> have the new ones, I want to make sure that following statements are
> still correct which I have taken form IPC-D-275.
>
> 4.1.8.1 Component Mounting Techniques for Shock and Vibration
>             Axial leaded components weighing less than 5 grams (0.18 oz)
> per lead shall be mounted with their bodies in intimate contact with the
> board. Dimensional criteria for lead bending and spacing shall be as
> specified in 4.2. Axial leaded components weighing 5 grams (0.18 oz) or
> more, per lead should be secured to the board utilizing mounting clamps.
> If the clamps are not practical due to density considerations, adhesive
> bonding techniques should be employed such that the solder connections
> are not the only means of mechanical support. These techniques are used
> for components weighing more than 5 grams (0.18 oz) when high vibration
> requirements must be met. (see paragraph 3.7.3.2 and figures 4-5 and
> 4-6.)
>
>
> re,
> Ken patel
>
> --------------------------------------------------------------------------
-------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------