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October 2001

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Subject:
Re: Land Patterns
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 31 Oct 2001 08:08:27 +0800
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text/plain (1181 bytes) , TEXT.htm (427 bytes) 
Thermal profile information is difficult to include on individual component
data sheets, as it depends on the solder you're going to use and the
thermal mass of other components around it on the board assembly.

Has a stone been set rolling down a mossy hill with this thread?

Pter Duncan



                    Kathy Kuhlow
                    <Kathy@BTW-IN        To:     [log in to unmask]
                    C.COM>               cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by:             Aero/ST Group)
                    TechNet              Subject:     Re: [TN] Land Patterns
                    <[log in to unmask]
                    ORG>


                    10/30/01
                    11:24 PM
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Could you add thermal profile information to the request list?

Kathy
(See attached file: TEXT.htm)



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