All,
I know that IPC-D-275 is superseded by IPC-2221 and 2222. As I don't
have the new ones, I want to make sure that following statements are
still correct which I have taken form IPC-D-275.

4.1.8.1 Component Mounting Techniques for Shock and Vibration
            Axial leaded components weighing less than 5 grams (0.18 oz)
per lead shall be mounted with their bodies in intimate contact with the
board. Dimensional criteria for lead bending and spacing shall be as
specified in 4.2. Axial leaded components weighing 5 grams (0.18 oz) or
more, per lead should be secured to the board utilizing mounting clamps.
If the clamps are not practical due to density considerations, adhesive
bonding techniques should be employed such that the solder connections
are not the only means of mechanical support. These techniques are used
for components weighing more than 5 grams (0.18 oz) when high vibration
requirements must be met. (see paragraph 3.7.3.2 and figures 4-5 and
4-6.)


re,
Ken patel

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