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October 2001

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Subject:
From:
"Dorothy M. Lush" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Aug 2001 10:46:15 -0700
Content-Type:
text/plain
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text/plain (80 lines)
Wolfgang,

What do you mean by "misplaced"? 
Do you mean it is missing?
Do you mean it is tombstoning?
Do you mean it is misaligned?
Do you mean it is in the wrong location?

Dorothy Lush

> ----------
> From:         Busko, Wolfgang[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Wednesday, August 15, 2001 4:22 AM
> To:   [log in to unmask]
> Subject:      AW: [TN] Misplace component
> 
> Hi Leonel,
> 
> if the processes are checked already and there seems to be no cause you
> might check your checks and focus on the results, if they clearly show
> that
> the particular process is definetly not the cause.
> 
> For the solderability of bare boards and parts, there´s always a good
> portion of trust in solderability of a whole batch after checking some
> samples.
> 
> Cleanliness is another major factor in this game, how is the handling
> done,
> is the dust removed prior to paste print (there´s always some of it right
> out of the sealed package), for how long do the printed boards wait until
> beeing reflowed, and what about temperature and humidity at these hot
> summer
> days, does your paste like it as it is now?
> 
> Just a couple of things which I think can contribute to that what you´re
> seeing.
> If it happened suddenly, can you find out what has changed?
> 
> Good luck
> Wolfgang
> 
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