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Subject:	Misplace component
From:	"<Leonel Jay J. Manuel>" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 15 Aug 2001 08:33:32 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (35 lines)

Hello Technetters,

     We currently have misplace component at a level of 0.2%. Component placement, solder land proportionality, solderabilty of component terminal and amount of solder was verified to be within specs. Reflow profile was also based in standard settings.
Can you give us some other possible root causes of the above mention problem  We are using 0402 SMD and SnPbAg no-clean solder paste.


Leonel Jay J. Manuel
Process Engineer
RF PCC Engineering
Philips Semiconductors Phils. Inc.
Office Tel: (6349) 5430001 to 25
                   : (632) 8445139 ext. 288
Fax No.    : (632) 8445248 / (6349) 5430027
E-mail       :[log in to unmask]

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