We use an Ersascope for peripheral inspection and Hewlett Packard 5DX
laminography for soldered BGA inspection (takes X-rays in slices so to
speak).
Both are quite costly as routine inspection tools (time consumption,
programming, etc) but are invaluable for referee decisions.

Janice Pelchat
Benchmark Electronics


> -----Original Message-----
> From: Mark Ross [SMTP:[log in to unmask]]
> Sent: Monday, July 30, 2001 9:56 AM
> To:   [log in to unmask]
> Subject:      [TN]
>
> We have a BGA we need to inspect.  However, the kicker is that
> directly below the BGA there is a socket adapter and we have tried
> XRAY and it fails miserably.
>
> Does anyone out there inspect UNDER a BGA once it is soldered in place
> with a boroscope or fiber optic camera?  Thanks.
>
> Mark Ross
> PCB Designer
> Accurate Technologies
>
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